Thermomechanical Analysis / Thermal Expansion Rate Measurement Device Discovery TMA
Various measurement modes! High-sensitivity mechanical analysis is possible over a wide temperature range.
The thermal analysis device/thermomechanical measurement device "TMA Series" is designed to measure dimensional changes of samples under controlled temperature, time, stress, and atmosphere. It offers a variety of measurement modes, enabling the evaluation of material excessive properties (such as creep and stress relaxation) and the separation of overlapping thermal events (MTMA). This product is a research and development grade thermomechanical measurement device, equipped with high performance suitable for research, education, and quality control applications. 【Features】 ■ High sensitivity measurement ■ High versatility ■ Variety of measurement modes ■ Capable of measurements over a wide temperature range
- Company：ティー・エイ・インスツルメント・ジャパン （TAInstruments）
- Price：Other
